• 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
  • 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
  • 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
  • 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
  • 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
  • 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board

0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board

Type: Copper Foil
Application: Air Condition or Refrigerator
Material: Red Copper
Shape: Foil
Alloy: Alloy
Color: Brown
Samples:
US$ 50/Piece 1 Piece(Min.Order)
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Customization:
Gold Member Since 2012

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Basic Info.

Model NO.
C11000 C1221
Standard
GB/T
Transport Package
Woodem Box
Specification
0.05mm*50mm
Trademark
ohmalloy
Origin
Shanghai
Production Capacity
500000kg

Product Description

0.05mm*50mm Pure Copper Foil C11000 C1221 foil for  Mobile phone main board
Copper is copper elemental,because its color is purplish red named.Red copper is industrial pure copper with a melting point of 1083ºC, no isomorphic transformation, and a relative density of 8.9, five times that of magnesium. It is about 15% heavier by volume than ordinary steel. Because it has rose red, the surface of the formation of oxidation film after purple, so commonly known as copper, it is a certain amount of oxygen copper, so also known as oxygen-containing copper.
Chemical Composition %
Alloy code Cu+Ag Sn Zn Pb Ni Fe Sb S As Bi O
C1100 ≥99.9 0.002 0.005 0.005 0.005 0.005 0.002 0.005 0.002 0.001 0.06
C11000 ≥99.9     0.005   0.005 0.002 0.005 0.002 0.001  
C1221 ≥99.9     0.005   0.005 0.002 0.005 0.002 0.001  
T2 ≥99.9     0.005   0.005 0.002 0.005 0.002 0.001  
T3 ≥99.9     0.005   0.005 0.002 0.005 0.002 0.001  
 
Mechanical properties (minimum)
Alloy code Tensile strength
Rm N/mm2
Yield strength
RP0.2N/mm2
Elongation
A5%
Sample size
thickness
C1100 275   10 5~40
C11000 295 65 3  
C1221 295 65 3  
T2 295 65 3  
T3 295 65    

Specifications of c11000 copper foil 
1) Grade: c11000,C12200 
2) Copper: cu min.99.90% 
3) Thickness: 0.005mm -1.2mm 
4) Width: max.600mm 
5) Coil weight:20T
6) Chemical Composition: Cu >99.90% p:0.015%-0.040% 
7) Temper: O, 1/4H, 1/2H, H O : HV100 
8) Electric 20°CConductivity: C11000 >97% ,C12200 >80%


Grade and Manufacturing information for thin copper foil
Chinese Grade Abroad Similar Brand
International USA JAPAN UK GERMANY
(ISO) (ASTM) (JIS) (BS) (DIN)
T2 Cu-ETP C11000 C1100 C101 R-Cu57
TP2 Cu-DHP C12200 C1220 C106 SI-CU
 
Grade Chinese State Specification Tensile  Strength Elongation Vickers Hardness
T2 M Thickness: 0.005-1.2mm
Width: (Max)600mm 
Coil Weight:6.5kg/mm
>205 >30 -
Y4 215-275 >25 55-100
TP2 Y2 245-345 >8 75-120
Features for thin copper foil  
1) Good viscosity,Cold resistance
2) Mechanical resistance,Moisture resistant
3) High thermal conductivity,Oil & acid resistant
4) Ageing-resistant
5) Flame retardant
6) Easy to tear apart

Applications for thin copper foil  
1) Electric and electric springs,switches
2) Lead frames
3) Connectors and oscillation reeds
3) PCB field
4) Communication cable
5) Cable armoring
6) Mobile phone main board
7) Ion battery production lamination with PI film 
8) PCB collector (electrode backing) materials

 0.05mm*50mm Pure Copper Foil C11000 C1221 Foil for Mobile Phone Main Board
Hiedy Jiang

Ohmalloy Material Co., Ltd

Add: No. 1211, Mudanjiang Road, Baoshan district, Shanghai 

 

   

      

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